From flagship to entry-level, all with SoM, mainboard and full-stack customization.
Octa-core 4×A76 + 4×A55, up to 2.4GHz; 6 TOPS NPU; 8K codec and multi-display.
Retains RK3588 core performance and NPU with fewer interfaces at lower cost.
Cost-optimized member of the RK3588 family with further simplified peripherals, for the mid-range market.
Octa-core 4×A72 + 4×A53, built-in 6 TOPS NPU, triple-display and rich expansion.
Quad-core A55, 1 TOPS NPU, dual gigabit Ethernet, rich industrial interfaces, proven stability.
Quad-core A55, simplified interfaces, low power — clear cost advantage at volume.
Professional IPC SoC: dual-core A7 + 2 TOPS NPU, built-in high-performance ISP, low power.
Ultra-low-power IPC SoC with 0.5 TOPS NPU, supports always-on and fast-boot scenarios.
Years of security-surveillance expertise across HiSilicon mainstream platforms, front-end and back-end, with rich SDK & ISP tuning experience.
Hi3516DV300 / DV500 professional IPC platforms with smart encoding and on-device AI analytics.
For high-end 4K AI IPC scenarios with strong ISP and NPU, suitable for complex lighting conditions.
Hi3536DV100, Hi3531DV200 back-end platforms for multi-channel video access and local storage.
One-stop HiSilicon engineering services from SoC selection to mass production.
Dual-OS deep customization — choose freely by product form factor.
Deep Android customization for interactive, signage and consumer terminals.
Linux customization for surveillance, industrial control and headless devices.
Three core product lines — front-end capture, back-end storage, smart terminals — with complete device-level delivery.
Smart network camera solutions on RV1126, RV1106 and HiSilicon Hi3516/3519, in bullet, dome, turret and battery form factors.
Multi-channel recording & storage on RK3568 / RK3588 and HiSilicon Hi3536/3531, with hybrid analog / IP access.
Interactive smart terminal devices for every industry, Android / Linux as needed, rapid mass production.
Deep software- and algorithm-layer customization on top of standard solutions for differentiated products.
Whether you need a single board or a full solution, Hongyin has the engineering capability.
Schematic design, PCB layout, SI/PI simulation, EMC pre-compliance.
Android / Linux trimming, ROM customization and production firmware maintenance.
Full-stack development: drivers, apps, host tools, cloud APIs.
Prototyping, burn-in testing, volume SMT and complete-device delivery.
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